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HPE 5218 processor 2.3 GHz 22 MB
SKU
SRF8TB
Category: Processors
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Box | Yes |
| Processor cores | 16 |
| Processor family | Intel Xeon Gold |
| SKU | SRF8TB |
| Manufacturer | Intel |
| Availability | Y |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22 MB |
| Processor ARK ID | 192444 |
| Processor model | 5218 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 192444 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
|---|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 87 °C |
| Packaging data | |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Other features | |
| Maximum internal memory | 1 TB |
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|---|---|---|---|---|---|---|
| SKU |
SRF8TB
|
YD3400C5FHBOX
|
YD3200C5FHBOX
|
YD3200C5M4MFH
|
BX80701G6405
|
BX8071512100F
|
| Manufacturer |
Intel
|
AMD
|
AMD
|
AMD
|
Intel
|
Intel
|
| Processor family |
Intel Xeon Gold
|
AMD Ryzen 5
|
AMD Ryzen 3
|
AMD Ryzen 3
|
Intel Pentium Gold
|
Intel Core i3
|
| Discrete graphics card |
N
|
N
|
N
|
N
|
N
|
N
|
| Processor lithography |
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
N/A
|
| Cooler included |
N
|
Y
|
Y
|
N
|
N/A
|
Y
|
| On-board graphics card |
N
|
Y
|
Y
|
Y
|
Y
|
N
|
| Processor socket |
LGA 3647 (Socket P)
|
Socket AM4
|
Socket AM4
|
Socket AM4
|
LGA 1200 (Socket H5)
|
LGA 1700
|
| Processor cores |
16
|
4
|
4
|
4
|
2
|
4
|
| Package type |
N/A
|
Box
|
Box
|
Tray
|
Box
|
Box
|