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Transcend MTE670T 256 GB M.2 PCI Express 3.0 NVMe 3D NAND
SKU
TS256GMTE670T
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30μ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
Category: Internal Solid State Drives
| SKU | TS256GMTE670T |
|---|---|
| Manufacturer | Transcend |
| Availability | N |
Transcend's M.2 SSD MTE670T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
Transcend also offers the MTE670T-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.
Transcend also offers the MTE670T-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| Memory type | 3D NAND |
| Data transmission | |
| Read speed | 2100 MB/s |
| Write speed | 1600 MB/s |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 150000 IOPS |
| Endurance | |
| Mean time between failures (MTBF) | 3000000 h |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | PC |
| SSD usage tag | Embedded |
| NVMe | Yes |
| NVMe version | 1.3 |
| TBW rating | 960 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| S.M.A.R.T. support | Yes |
| Read speed | 2100 MB/s |
| TRIM support | Yes |
| Write speed | 1600 MB/s |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 150000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| SSD form factor | M.2 |
| Power | |
| Power consumption (average) | 3.1 W |
| Power consumption (idle) | 0.4 W |
| Operating voltage | 3.3 V |
| Performance | |
|---|---|
| Interface | PCI Express 3.0 |
| Component for | PC |
| SSD usage tag | Embedded |
| NVMe | Yes |
| NVMe version | 1.3 |
| TBW rating | 960 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 256 GB |
| S.M.A.R.T. support | Yes |
| Read speed | 2100 MB/s |
| TRIM support | Yes |
| Write speed | 1600 MB/s |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 280000 IOPS |
| Random read (4KB) | 150000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| Design | |
| Component for | PC |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 80 mm |
| Weight | 9 g |
| Height | 2.23 mm |
| Depth | 22 mm |
| Operational conditions | |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1500 G |
| Operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 3.0 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | -20 - 75 °C |
| TRIM support | Yes |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| ECC | Yes |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1500 G |
| Operating vibration | 20 G |
| SSD form factor | M.2 |
| Compliance certificates | CE, RoHS |
| Other features | |
| Compliance certificates | CE, RoHS |