Transcend MTE670T 256 GB M.2 PCI Express 3.0 NVMe 3D NAND

SKU
TS256GMTE670T
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256 GB, M.2, PCIe Gen3 x4, NVMe, 3D NAND, S.M.A.R.T., TRIM
  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • TRIM command for better performance
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30μ" PCB gold finger
  • Anti-sulfur technology implemented to prevent sulfurization in the environment
  • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
  • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
  • Supports Transcend Scope Pro software
More Information
SKU TS256GMTE670T
Manufacturer Transcend
Availability N
Transcend's M.2 SSD MTE670T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.


Transcend also offers the MTE670T-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.
Hard drive
PCI Express interface data lanesx4
SSD capacity256 GB
Memory type3D NAND
Data transmission
Read speed2100 MB/s
Write speed1600 MB/s
Random write (4KB)280000 IOPS
Random read (4KB)150000 IOPS
Endurance
Mean time between failures (MTBF)3000000 h
Features
InterfacePCI Express 3.0
Component forPC
SSD usage tagEmbedded
NVMeYes
NVMe version1.3
TBW rating960
PCI Express interface data lanesx4
SSD capacity256 GB
S.M.A.R.T. supportYes
Read speed2100 MB/s
TRIM supportYes
Write speed1600 MB/s
ECCYes
Memory type3D NAND
Random write (4KB)280000 IOPS
Random read (4KB)150000 IOPS
Mean time between failures (MTBF)3000000 h
SSD form factorM.2
Power
Power consumption (average)3.1 W
Power consumption (idle)0.4 W
Operating voltage3.3 V
Performance
InterfacePCI Express 3.0
Component forPC
SSD usage tagEmbedded
NVMeYes
NVMe version1.3
TBW rating960
PCI Express interface data lanesx4
SSD capacity256 GB
S.M.A.R.T. supportYes
Read speed2100 MB/s
TRIM supportYes
Write speed1600 MB/s
ECCYes
Memory type3D NAND
Random write (4KB)280000 IOPS
Random read (4KB)150000 IOPS
Mean time between failures (MTBF)3000000 h
Design
Component forPC
SSD form factorM.2
Weight & dimensions
Width80 mm
Weight9 g
Height2.23 mm
Depth22 mm
Operational conditions
Operating temperature (T-T)-20 - 75 °C
Storage temperature (T-T)-40 - 85 °C
Operating relative humidity (H-H)5 - 95%
Storage relative humidity (H-H)5 - 95%
Operating shock1500 G
Operating vibration20 G
Technical details
InterfacePCI Express 3.0
S.M.A.R.T. supportYes
Operating temperature (T-T)-20 - 75 °C
TRIM supportYes
Storage temperature (T-T)-40 - 85 °C
Operating relative humidity (H-H)5 - 95%
ECCYes
Storage relative humidity (H-H)5 - 95%
Operating shock1500 G
Operating vibration20 G
SSD form factorM.2
Compliance certificatesCE, RoHS
Other features
Compliance certificatesCE, RoHS