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Transcend MTE662P 128 GB M.2 PCI Express 3.1 NVMe 3D NAND
SKU
TS128GMTE662P
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128GB, M.2 2280, 3D NAND, PCIe 3.1 x2, NVMe 1.3, S.M.A.R.T, ECC, 3.3V, 22x80x3.88mm, 9g
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- DDR4 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30μ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
Category: Internal Solid State Drives
| SKU | TS128GMTE662P |
|---|---|
| EAN | 0760557845201 |
| Manufacturer | Transcend |
| Availability | N |
Transcend's MTE662P M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662P features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662P is fully tested in-house, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C. The built-in Power Loss Protection (PLP) further ensures data integrity in mission-critical applications.
Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.
Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x4 |
| SSD capacity | 128 GB |
| Memory type | 3D NAND |
| Data transmission | |
| Random write (4KB) | 355000 IOPS |
| Random read (4KB) | 340000 IOPS |
| Endurance | |
| Data retention | 3 year(s) |
| Mean time between failures (MTBF) | 3000000 h |
| Features | |
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 2300 MB/s |
| Sequential read speed (CDM) | 3400 MB/s |
| TBW rating | 2200 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 128 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 355000 IOPS |
| Random read (4KB) | 340000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| SSD form factor | M.2 |
| PCI Express CEM revision | 3.1 |
| M.2 key ID | M |
| M.2 SSD size | 2280 (22 x 80 mm) |
| Drive writes per day (DWPD) | 2 |
| Power | |
| Power consumption (average) | 3.4 W |
| Power consumption (idle) | 0.9 W |
| Operating voltage | 3.3 V |
| Performance | |
|---|---|
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 2300 MB/s |
| Sequential read speed (CDM) | 3400 MB/s |
| TBW rating | 2200 |
| PCI Express interface data lanes | x4 |
| SSD capacity | 128 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 355000 IOPS |
| Random read (4KB) | 340000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| PCI Express CEM revision | 3.1 |
| Design | |
| Component for | PC/Laptop |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 22 mm |
| Weight | 9 g |
| Height | 3.88 mm |
| Depth | 80 mm |
| Operational conditions | |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 3.1 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| ECC | Yes |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| SSD form factor | M.2 |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |
| Other features | |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |