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Transcend MTE460T-I 512 GB M.2 PCI Express 3.1 NVMe 3D NAND
SKU
TS512GMTE460T-I
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In stock
512GB, 3D NAND, PCIe 301 x2, NVMe 1.3, S.M.A.R.T, TRIM, NCQ, , 3.3V, 22x42x3.58mm, 5g
- Supports NVM command
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Static Data Refresh
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
- PCIe Gen 3 x2 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30μ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
Category: Internal Solid State Drives
| SKU | TS512GMTE460T-I |
|---|---|
| EAN | 0760557861010 |
| Manufacturer | Transcend |
| Availability | N |
Transcend's MTE460T PCIe M.2 SSD features a PCIe Gen 3x2 interface and 112-layer 3D NAND flash, delivering breakthrough density that greatly improves storage efficiency. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE460T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃. Wide-temp capability (-40℃~85℃) can also be provided upon request, optimizing stability in extreme environments.
| Hard drive | |
|---|---|
| PCI Express interface data lanes | x2 |
| SSD capacity | 512 GB |
| Memory type | 3D NAND |
| Data transmission | |
| Random write (4KB) | 225000 IOPS |
| Random read (4KB) | 92000 IOPS |
| Endurance | |
| Data retention | 3 year(s) |
| Mean time between failures (MTBF) | 3000000 h |
| Features | |
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 1500 MB/s |
| Sequential read speed (CDM) | 1700 MB/s |
| TBW rating | 900 |
| PCI Express interface data lanes | x2 |
| SSD capacity | 512 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| TRIM support | Yes |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 225000 IOPS |
| Random read (4KB) | 92000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| Hardware encryption | Yes |
| SSD form factor | M.2 |
| PCI Express CEM revision | 3.1 |
| M.2 key ID | B+M |
| M.2 SSD size | 2242 (22 x 42 mm) |
| Drive writes per day (DWPD) | 0.86 |
| Power | |
| Power consumption (average) | 2.9 W |
| Power consumption (idle) | 0.33 W |
| Operating voltage | 3.3 V |
| Performance | |
|---|---|
| Interface | PCI Express 3.1 |
| Component for | PC/Laptop |
| NVMe | Yes |
| NVMe version | 1.3 |
| Sequential write speed (CDM) | 1500 MB/s |
| Sequential read speed (CDM) | 1700 MB/s |
| TBW rating | 900 |
| PCI Express interface data lanes | x2 |
| SSD capacity | 512 GB |
| S.M.A.R.T. support | Yes |
| Data retention | 3 year(s) |
| TRIM support | Yes |
| ECC | Yes |
| Memory type | 3D NAND |
| Random write (4KB) | 225000 IOPS |
| Random read (4KB) | 92000 IOPS |
| Native Command Queuing (NCQ) | Yes |
| Mean time between failures (MTBF) | 3000000 h |
| Hardware encryption | Yes |
| PCI Express CEM revision | 3.1 |
| Design | |
| Component for | PC/Laptop |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 22 mm |
| Weight | 5 g |
| Height | 3.58 mm |
| Depth | 42 mm |
| Operational conditions | |
| Operating temperature (T-T) | -20 - 75 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 3.1 |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | -20 - 75 °C |
| TRIM support | Yes |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| ECC | Yes |
| Operating shock | 15 G |
| Operating vibration | 20 G |
| Native Command Queuing (NCQ) | Yes |
| Hardware encryption | Yes |
| SSD form factor | M.2 |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |
| Other features | |
| Compliance certificates | BSMI, CE, Federal Communications Commission (FCC), UKCA |