Toshiba KBG30ZMS256G internal solid state drive M.2 256 GB PCI Express 3.1 TLC NVMe

SKU
KBG30ZMS256G
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In stock
256GB, PCIe Gen3 2L NVMe
The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASHâ„¢ and features NVMeâ„¢ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
SKU KBG30ZMS256G
EAN 8592978182120
Specification
Hard drive
SSD capacity256 GB
Memory typeTLC
Data transmission
Read speed1400 MB/s
Write speed800 MB/s
Performance
InterfacePCI Express 3.1
Component forNotebook
NVMeYes
NVMe version1.2.1
SSD capacity256 GB
Read speed1400 MB/s
Write speed800 MB/s
Memory typeTLC
Hardware encryptionNo
Design
Component forNotebook
SSD form factorM.2
Features
InterfacePCI Express 3.1
Component forNotebook
NVMeYes
NVMe version1.2.1
SSD capacity256 GB
Read speed1400 MB/s
Write speed800 MB/s
Memory typeTLC
Hardware encryptionNo
SSD form factorM.2
Power
Power consumption (write)3.3 W
Power consumption (read)3.3 W
Operating voltage3.3 V
Operational conditions
Operating temperature (T-T)0 - 80 °C
Storage temperature (T-T)-40 - 85 °C
Technical details
InterfacePCI Express 3.1
Operating temperature (T-T)0 - 80 °C
Storage temperature (T-T)-40 - 85 °C
Hardware encryptionNo
SSD form factorM.2
Weight & dimensions
Width22 mm
Weight2.42 g
Height2.18 mm
Depth30 mm
Manufacturer Toshiba
In Stock N