| Processor |
|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2 GHz |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 8164 |
| Processor threads | 52 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 26 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory |
|---|
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics |
|---|
| On-board graphics card | No |
| Power |
|---|
| Thermal Design Power (TDP) | 150 W |
| Technical details |
|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features |
|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| Processor package size | 76 x 56.5 mm |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features |
|---|
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions |
|---|
| Tcase | 85 °C |
| Weight & dimensions |
|---|
| Processor package size | 76 x 56.5 mm |
