Lenovo Intel Xeon Gold 6254 processor 3.1 GHz 25 MB L3

SKU
4XG7A14258
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Intel Xeon Gold 6254, 25M Cache, 3.1 GHz, 200 W TDP, FCLGA3647
Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows:

- Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor
- Processors with an M suffix (eg 8260M): Up to 2 TB per processor
- All other processors: Up to 1 TB per processor

The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server.

For example:
- A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required
- A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required
- A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used)
- A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required

The following table lists the features of the supported second-generation Intel Xeon processors.
SKU 4XG7A14258
EAN 0889488483211
Specification
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency3.1 GHz
Cooler includedNo
Thermal Design Power (TDP)200 W
Processor cache25 MB
Processor model6254
Processor threads36
Processor operating modes64-bit
Processor boost frequency4 GHz
SteppingB1
Bus typeUPI
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores18
BoxNo
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor1000 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)200 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability4S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)200 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)200 W
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX-512
Scalability4S
Embedded options availableNo
Market segmentServer
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase82 °C
Manufacturer Lenovo
In Stock N