IBM Intel Xeon X5690 processor 3.46 GHz 12 MB L3

SKU
81Y9331-RFB
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In stock
Intel Xeon Processor X5690 (12M Cache, 3.46 GHz, 6.40 GT/s Intel QPI)
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t. Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
SKU 81Y9331-RFB
EAN 5711045317293
Specification
Processor
Processor base frequency3.46 GHz
Memory bandwidth supported by processor (max)32 GB/s
Thermal Design Power (TDP)130 W
Processor cache12 MB
Processor modelX5690
Processor threads12
System bus rate6.4 GT/s
Processor operating modes64-bit
VID Voltage Range0.750 - 1.350 V
Processor boost frequency3.73 GHz
Number of QPI links2
Bus typeQPI
Component forServer/workstation
Processor lithography32 nm
Processor familyIntel® Xeon® 5000 Sequence
Processor cores6
Processor socketSocket B (LGA 1366)
Processor cache typeL3
Memory
Maximum internal memory supported by processor288 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor800,1066,1333 MHz
Memory bandwidth supported by processor (max)32 GB/s
Memory channelsTriple-channel
ECCYes
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)130 W
VID Voltage Range0.750 - 1.350 V
Technical details
Thermal Monitoring TechnologiesNo
Intel® Turbo Boost Technology1.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
Supported instruction setsSSE4.2
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Demand Based SwitchingYes
Embedded options availableNo
CPU configuration (max)2
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Thermal Design Power (TDP)130 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
Features
Thermal Design Power (TDP)130 W
Thermal Monitoring TechnologiesNo
Idle StatesYes
Execute Disable BitYes
Supported instruction setsSSE4.2
Embedded options availableNo
CPU configuration (max)2
Market segmentServer
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® Turbo Boost Technology1.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Demand Based SwitchingYes
Intel Virtualization Technology (VT-x)Yes
Operational conditions
Tcase78.5 °C
Other features
CPU configuration (max)2
Manufacturer IBM
In Stock N