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HP Intel Celeron B810 processor 1.6 GHz 2 MB L3 Tray
SKU
646760-001
Category: Processors
| Processor socket | PGA988 |
|---|---|
| Box | No |
| Processor cores | 2 |
| Processor family | Intel Celeron |
| SKU | 646760-001 |
| EAN | 5712505000304 |
| Manufacturer | HP |
| Availability | N |
Experience brilliant PC performance that lets you communicate with friends and family, enjoy entertainment, and get your work done. Get the Intel-level performance you've come to expect and quality you can count on with an Intel® Celeron® processor.
| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Memory bandwidth supported by processor (max) | 21.3 GB/s |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 2 MB |
| Processor model | B810 |
| Processor threads | 2 |
| Processor operating modes | 64-bit |
| Stepping | Q0 |
| Processor lithography | 32 nm |
| Processor family | Intel® Celeron® |
| Processor cores | 2 |
| Processor socket | PGA988 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 16 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066,1333 MHz |
| Memory bandwidth supported by processor (max) | 21.3 GB/s |
| Memory channels | Dual-channel |
| ECC | No |
| Graphics | |
| Number of displays supported (on-board graphics) | 2 |
| On-board graphics card model | Intel® HD Graphics |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 950 MHz |
| On-board graphics card base frequency | 650 MHz |
| Power | |
| Thermal Design Power (TDP) | 35 W |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Wireless Display (Intel® WiDi) | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Quick Sync Video Technology | No |
| Intel® My WiFi Technology (Intel® MWT) | No |
| Intel® InTru™ 3D Technology | No |
| Intel® Insider™ | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | No |
| Intel® Anti-Theft Technology (Intel® AT) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Intel Demand Based Switching | No |
| Graphics & IMC lithography | 32 nm |
| Embedded options available | Yes |
| Thermal Design Power (TDP) | 35 W |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 16 |
| Thermal Design Power (TDP) | 35 W |
| Integrated 4G WiMAX | No |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Graphics & IMC lithography | 32 nm |
| Embedded options available | Yes |
| Processor special features | |
| Intel® Wireless Display (Intel® WiDi) | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Smart Cache | Yes |
| Intel® Quick Sync Video Technology | No |
| Intel® My WiFi Technology (Intel® MWT) | No |
| Intel® InTru™ 3D Technology | No |
| Intel® Insider™ | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | No |
| Intel® Anti-Theft Technology (Intel® AT) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |