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Acer Intel Xeon L3110 processor 3 GHz 6 MB L2 Tray
SKU
KC.31101.EUL
Category: Processors
| SKU | KC.31101.EUL |
|---|---|
| EAN | 4054318255467 |
| Manufacturer | Acer |
| Availability | N |
The Intel® Xeon® processor 3000 sequence-based platforms unleash the computing power of Intel® Xeon® processors. The new 45 nm Quad and Dual-Core processors feature enhanced Intel® Core™ microarchitecture that provides your business with exceptional performance and power efficiency at a very affordable cost.
These servers are ideal for small business owners looking for ways to grow business, manage operation more effectively and efficiently, and protect and secure one of their most important assets - information.
These servers are ideal for small business owners looking for ways to grow business, manage operation more effectively and efficiently, and protect and secure one of their most important assets - information.
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Thermal Design Power (TDP) | 45 W |
| Processor cache | 6 MB |
| Processor model | L3110 |
| Processor operating modes | 64-bit |
| L2 cache speed | 3 GHz |
| Component for | Server/workstation |
| Processor lithography | 45 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor front side bus | 1333 MHz |
| Processor cores | 2 |
| Processor socket | LGA 775 (Socket T) |
| Processor cache type | L2 |
| Package type | Tray |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 45 W |
| Technical details | |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| L2 cache speed | 3 GHz |
| Thermal Design Power (TDP) | 45 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Features | |
|---|---|
| Thermal Design Power (TDP) | 45 W |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Market segment | Server |
| Processor special features | |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 78.65 °C |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |