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Acer Intel Pentium G6950 processor 2.8 GHz 3 MB L3 Tray
SKU
KC.69501.DEK
Category: Processors
| SKU | KC.69501.DEK |
|---|---|
| Manufacturer | Acer |
| Availability | N |
The Intel Pentium processor with Intel dual-core technology delivers great desktop performance, low power enhancements, and multitasking for everyday computing.
Intel dual-core processing
Runs two independent processor cores in one physical package at the same frequency. Features up to 2 MB of shared L2 cache and 800 MHz Front Side Bus.
Intel Wide Dynamic Execution
Enables delivery of more instructions per clock cycle to improve execution time and energy efficiency.
Intel Smart Memory Access
Improves system performance by optimizing the use of the available data bandwidth.
Intel Advanced Smart Cache
The shared L2 cache is dynamically allocated to each processor core based on workload. This increases the probability that each core can access data from fast L2 cache, significantly reducing latency to frequently used data and improving performance.
Intel Advanced Digital Media Boost
Accelerates a broad range of multimedia, encryption, scientific and financial applications by significantly improving performance when executing Intel® Streaming SIMD Extension (SSE/SSE2/SSE3) instructions.
Intel 64 architecture
An enhancement to Intel’s 32-bit architecture to enable the processor to access larger amounts of memory.
Execute Disable Bit
Provides enhanced virus protection when deployed with a supported operating system.
Intel designed thermal solution for boxed processors
Intel boxed processors ship with a thermal solution specifically for this processor designed for maximum thermal and acoustic performance.
Intel dual-core processing
Runs two independent processor cores in one physical package at the same frequency. Features up to 2 MB of shared L2 cache and 800 MHz Front Side Bus.
Intel Wide Dynamic Execution
Enables delivery of more instructions per clock cycle to improve execution time and energy efficiency.
Intel Smart Memory Access
Improves system performance by optimizing the use of the available data bandwidth.
Intel Advanced Smart Cache
The shared L2 cache is dynamically allocated to each processor core based on workload. This increases the probability that each core can access data from fast L2 cache, significantly reducing latency to frequently used data and improving performance.
Intel Advanced Digital Media Boost
Accelerates a broad range of multimedia, encryption, scientific and financial applications by significantly improving performance when executing Intel® Streaming SIMD Extension (SSE/SSE2/SSE3) instructions.
Intel 64 architecture
An enhancement to Intel’s 32-bit architecture to enable the processor to access larger amounts of memory.
Execute Disable Bit
Provides enhanced virus protection when deployed with a supported operating system.
Intel designed thermal solution for boxed processors
Intel boxed processors ship with a thermal solution specifically for this processor designed for maximum thermal and acoustic performance.
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Thermal Design Power (TDP) | 73 W |
| Processor cache | 3 MB |
| Processor model | G6950 |
| Processor threads | 2 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| Compatible chipsets | Intel® 3450, Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express |
| VID Voltage Range | 0.6500 - 1.4000 V |
| L3 cache speed | 2.8 GHz |
| Bus type | DMI |
| Component for | PC |
| Processor lithography | 32 nm |
| Processor family | Intel Pentium G |
| Processor cores | 2 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 16 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066 MHz |
| Memory bandwidth supported by processor (max) | 17 GB/s |
| Memory channels | Dual-channel |
| Graphics | |
| Number of displays supported (on-board graphics) | 2 |
| On-board graphics card | Yes |
| On-board graphics card base frequency | 553 MHz |
| Power | |
| Thermal Design Power (TDP) | 73 W |
| VID Voltage Range | 0.6500 - 1.4000 V |
| Technical details | |
| Intel® Smart Cache | Yes |
| Intel FDI Technology | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| L3 cache speed | 2.8 GHz |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| CPU configuration (max) | 1 |
| Thermal Design Power (TDP) | 73 W |
| Market segment | Desktop |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 16 |
| Thermal Design Power (TDP) | 73 W |
| Processor package size | 37.5 mm |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | Yes |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Processor special features | |
| Intel® Smart Cache | Yes |
| Intel FDI Technology | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 72.6 °C |
| Packaging data | |
| Package type | Tray |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| CPU configuration (max) | 1 |