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Acer Intel Core i5-3570T processor 2.3 GHz 6 MB L3 Tray
SKU
KC.35701.TI5
Category: Processors
| SKU | KC.35701.TI5 |
|---|---|
| EAN | 4054317387350 |
| Manufacturer | Acer |
| Availability | N |
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
| Processor | |
|---|---|
| Processor generation | 3rd gen Intel® Core™ i5 |
| Processor base frequency | 2.3 GHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Thermal Design Power (TDP) | 45 W |
| Processor cache | 6 MB |
| Processor model | i5-3570T |
| Processor threads | 4 |
| System bus rate | 5 GT/s |
| Processor operating modes | 64-bit |
| Compatible chipsets | Intel® B75 Express, Intel® H61 Express, Intel® H77 Express, Intel Q75 Express, Intel® Q77 Express, Intel® Z75 Express, Intel® Z77 Express |
| Processor boost frequency | 3.3 GHz |
| Stepping | E1 |
| L3 cache speed | 2.3 GHz |
| Bus type | DMI |
| Component for | PC |
| Processor lithography | 22 nm |
| Processor family | Intel® Core™ i5 |
| Processor cores | 4 |
| Processor socket | LGA 1155 (Socket H2) |
| Processor code | SR0P1 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 32 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1333,1600 MHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory channels | Dual-channel |
| ECC | No |
| Graphics | |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card model | Intel® HD Graphics 2500 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1150 MHz |
| On-board graphics card base frequency | 650 MHz |
| Power | |
| Thermal Design Power (TDP) | 45 W |
| Technical details | |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Wireless Display (Intel® WiDi) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Insider™ | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel FDI Technology | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® Anti-Theft Technology (Intel® AT) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | AVX, SSE4.1, SSE4.2 |
| L3 cache speed | 2.3 GHz |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Graphics & IMC lithography | 22 nm |
| CPU configuration (max) | 1 |
| Processor code | SR0P1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 45 W |
| Market segment | Desktop |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
|---|---|
| Thermal Design Power (TDP) | 45 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | AVX, SSE4.1, SSE4.2 |
| Graphics & IMC lithography | 22 nm |
| CPU configuration (max) | 1 |
| Processor code | SR0P1 |
| Market segment | Desktop |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Conflict-Free processor | Yes |
| Intel® Secure Key | Yes |
| Intel® Wireless Display (Intel® WiDi) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Insider™ | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel FDI Technology | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® Anti-Theft Technology (Intel® AT) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 69.8 °C |
| Packaging data | |
| Package type | Tray |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| CPU configuration (max) | 1 |
| Processor code | SR0P1 |