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Acer Intel Celeron 1000M processor 1.8 GHz 2 MB L3 Tray
SKU
KC.10001.CMP
Category: Processors
| SKU | KC.10001.CMP |
|---|---|
| Manufacturer | Acer |
| Availability | N |
Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
| Processor | |
|---|---|
| Processor base frequency | 1.8 GHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 2 MB |
| Processor model | 1000M |
| Processor threads | 2 |
| System bus rate | 5 GT/s |
| Processor operating modes | 64-bit |
| Compatible chipsets | Intel® HM70 Express, Intel® HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel® QM77 Express |
| Stepping | P0 |
| L3 cache speed | 1.8 GHz |
| Bus type | DMI |
| Component for | Laptop |
| Processor lithography | 22 nm |
| Processor family | Intel® Celeron® |
| Processor cores | 2 |
| Processor socket | PGA988 |
| Processor code | SR102 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 32 GB |
| Memory types supported by processor | DDR3L-SDRAM |
| Memory clock speeds supported by processor | 1333,1600 MHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory channels | Dual-channel |
| ECC | No |
| Graphics | |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card model | Intel® HD Graphics |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1000 MHz |
| On-board graphics card base frequency | 650 MHz |
| Power | |
| Thermal Design Power (TDP) | 35 W |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Smart Cache | Yes |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | SSE4.1, SSE4.2 |
| L3 cache speed | 1.8 GHz |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Graphics & IMC lithography | 22 nm |
| CPU configuration (max) | 1 |
| Processor code | SR102 |
| Thermal Design Power (TDP) | 35 W |
| Market segment | Mobile |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 1 |
| Thermal Design Power (TDP) | 35 W |
| Processor package size | 37.5 mm |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | SSE4.1, SSE4.2 |
| Graphics & IMC lithography | 22 nm |
| CPU configuration (max) | 1 |
| Processor code | SR102 |
| Market segment | Mobile |
| Processor special features | |
| Conflict-Free processor | Yes |
| Intel® Smart Cache | Yes |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tjunction | 105 °C |
| Packaging data | |
| Package type | Tray |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| CPU configuration (max) | 1 |
| Processor code | SR102 |